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Guidelines – Holes in Heat Sinks for Self-tapping Screws
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2011-02-23
As components, traces, and function densities expand on printed circuit boards, and other electronic products compress more capacity into smaller enclosures, so too, heat dissipation and absorption techniques are more likely to be employed. Cooling is commonly achieved by utilizing heat sinks – these devices are usually made from a thermodynamic material such as aluminum. Designs provide as much exposed surface as possible, usually with an array of fins produced by the extrusion or casting process, and mounted in direct or radiant contact with heat generating components.
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Lon DeHaitre